Defond and academia join forces to drive innovation
In 2020, we are so privileged to participate in a joint-research program with The University of Hong Kong. This unique program is co-sponsored by HKSAR (Hong Kong Special Administrative Region) Government’s Innovation and Technology Commission and targeted in acoustics and thermal areas with the objective to upgrade key performance (e.g. A low-noise device for cooling electronic components based on novel nickel hydroxide actuating materials).
The philosophy of product design in Defond is holistic, focusing not only fulfillment of customer specifications, performance and application use, but also 360 consideration of the optimization of the key primary functions (such as mechanical, electrical, thermal, acoustics, etc.). Converging the multiple prerequisites, our exceptional engineering teams maintain close communication with top-tier research institutions to stay ahead of competitions with cutting-edge technologies through research work program-collaborations.
We believe this collaboration will turn bright ideas into solutions that make a real difference in the world.
(July 2020)
